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Effect of Hydrogen Peroxide(H2O2) in Citric Acid Based Cu Slurry on Cu CMP

Authors
박진구
Issue Date
8-Aug-2004
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/30376
Place
Lake Placid, NY
Conference Name
9th International Symposium on Chemical-Mechanical Planarization
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COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers

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Park, Jin Goo
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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