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Removal of UV cured resin using hybrid cleaning method

Authors
Kim, Min suKang, Bong KyunKim, Jae kwanLee, Byung kyuPark, Jin-Goo
Issue Date
Dec-2012
Publisher
Scitec Publications Ltd.
Keywords
Megasonic; Resin removal; THF; UV-NIL
Citation
Solid State Phenomena, v.195, pp 30 - 33
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
Solid State Phenomena
Volume
195
Start Page
30
End Page
33
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/30547
DOI
10.4028/www.scientific.net/SSP.195.30
ISSN
1012-0394
1662-9779
Abstract
Ultraviolet based nanoimprint lithography (UV-NIL) technology is widely used in nanosized fine pattern transfer. NIL, which uses low pressure and low temperature, makes it possible to fabricate 3-dimensional pattern [. So, UV-NIL is one of the techniques with great potential as a new manufacturing process. But, UV-NIL process uses an expensive quartz substrate for transmission of UV light. Therefore, quartz substrate needs to be recycled to reduce the manufacturing cost. Usually, UV-NIL uses UV curable resins, whose chemical bonding and structure could be altered during UV light exposure which would result in crosslinking between the polymers. This UV cured resin with cross-linked structure is very hard to remove from the quartz substrate [. Conventionally, UV cured resin is removed by treating with sulfuric acid-hydrogen peroxide mixture (SPM) followed by ammonium hydroxide-hydrogen peroxide mixture (APM). One of the major drawbacks in using SPM-based treatment is the chemical haze formation and particle contamination on the quartz substrate [. Thus, an alternative cleaning composition will be of interest.
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Park, Jin Goo
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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