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Evaluation of glass lapping using fixed abrasive pad

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dc.contributor.authorKim, Hyuk min-
dc.contributor.authorManivannan, R.-
dc.contributor.authorMoon, Deog ju-
dc.contributor.authorKwon, Tae young-
dc.contributor.authorNoh, Jin hyeong-
dc.contributor.authorPark, Jin goo-
dc.date.accessioned2021-06-23T08:07:44Z-
dc.date.available2021-06-23T08:07:44Z-
dc.date.created2021-05-11-
dc.date.issued2012-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/33933-
dc.description.abstractGlass ceramics is one of the key materials for the optoelectronic devices. In this work, double-sided lapping experiments were performed for various glass substrates (Borofloat, BK7, Quartz) using fixed abrasive pad with deionized water as coolant and the removal rate, hardness and roughness were reported at a lapping pressure of 0.6kgf/cm2 and speed of 50 rpm. We found that the material removal rate is dominantly influenced by the mechanical properties of the substrate. The higher removal rate seen in the case of borofloat when compared to the other two substrates is due to the lower hardness. The glass studied in this work follows the two body brittle fracture mechanism, based on the calculation obtained using the residue size and the mechanical properties of the glass.-
dc.language영어-
dc.language.isoen-
dc.publisherVDE Verlag GmbH-
dc.titleEvaluation of glass lapping using fixed abrasive pad-
dc.typeArticle-
dc.contributor.affiliatedAuthorPark, Jin goo-
dc.identifier.scopusid2-s2.0-85099451344-
dc.identifier.bibliographicCitationICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings, pp.409 - 414-
dc.relation.isPartOfICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings-
dc.citation.titleICPT 2012 - International Conference on Planarization/CMP Technology, Proceedings-
dc.citation.startPage409-
dc.citation.endPage414-
dc.type.rimsART-
dc.type.docTypeConference Paper-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscopus-
dc.subject.keywordPlusDeionized water-
dc.subject.keywordPlusGlass ceramics-
dc.subject.keywordPlusHardness-
dc.subject.keywordPlusLapping-
dc.subject.keywordPlusOptoelectronic devices-
dc.subject.keywordPlusSubstrates-
dc.subject.keywordPlusBrittle fracture mechanism-
dc.subject.keywordPlusFixed abrasives-
dc.subject.keywordPlusGlass substrates-
dc.subject.keywordPlusKey materials-
dc.subject.keywordPlusLapping pressure-
dc.subject.keywordPlusLower hardness-
dc.subject.keywordPlusMaterial removal rate-
dc.subject.keywordPlusRemoval rate-
dc.subject.keywordPlusAbrasives-
dc.subject.keywordAuthorDiamond-
dc.subject.keywordAuthorFixed abrasive pad-
dc.subject.keywordAuthorGlass-
dc.subject.keywordAuthorLapping-
dc.subject.keywordAuthorSelf-dressing-
dc.identifier.urlhttps://ieeexplore.ieee.org/document/6353817-
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