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그라운드 평면을 갖는 다층구조 IC패키지 시스템에서 동시 스위칭 노이즈 모델링
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 어영선 | - |
| dc.date.accessioned | 2021-06-23T08:10:59Z | - |
| dc.date.available | 2021-06-23T08:10:59Z | - |
| dc.date.issued | 1999-06-01 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34064 | - |
| dc.description.abstract | It is essential to estimate an effective inductance in a ground plane of multi-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values,maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35㎛ CMOS technology. | - |
| dc.title | 그라운드 평면을 갖는 다층구조 IC패키지 시스템에서 동시 스위칭 노이즈 모델링 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 전자공학회 하계 학술대회 | - |
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Related Researcher
- EO, YUNG SEON
- ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)