그라운드 평면을 갖는 다층구조 IC패키지 시스템에서 동시 스위칭 노이즈 모델링

Abstract

It is essential to estimate an effective inductance in a ground plane of multi-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values,maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35㎛ CMOS technology.