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다층 배선에서 차폐효과 모델 및 스위칭에 미치는 영향

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dc.contributor.author어영선-
dc.date.accessioned2021-06-23T08:12:28Z-
dc.date.available2021-06-23T08:12:28Z-
dc.date.issued1998-11-21-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34204-
dc.description.abstractNew capacitance modeling and transient analysis for multi-layer interconnects with shielding effect are presented. The upper layer capacitances with under-layer shielding lines are represented by introducing a filling factor which can be defined as the ratio of upper-layer line length to the total under-layer line width.-
dc.title다층 배선에서 차폐효과 모델 및 스위칭에 미치는 영향-
dc.typeConference-
dc.citation.conferenceName대한전자공학회 추계 학술대회-
dc.citation.conferencePlace경북대-
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COLLEGE OF ENGINEERING SCIENCES > SCHOOL OF ELECTRICAL ENGINEERING > 2. Conference Papers

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ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
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