다층 배선에서 차폐효과 모델 및 스위칭에 미치는 영향
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 어영선 | - |
dc.date.accessioned | 2021-06-23T08:12:28Z | - |
dc.date.available | 2021-06-23T08:12:28Z | - |
dc.date.issued | 1998-11-21 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34204 | - |
dc.description.abstract | New capacitance modeling and transient analysis for multi-layer interconnects with shielding effect are presented. The upper layer capacitances with under-layer shielding lines are represented by introducing a filling factor which can be defined as the ratio of upper-layer line length to the total under-layer line width. | - |
dc.title | 다층 배선에서 차폐효과 모델 및 스위칭에 미치는 영향 | - |
dc.type | Conference | - |
dc.citation.conferenceName | 대한전자공학회 추계 학술대회 | - |
dc.citation.conferencePlace | 경북대 | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
55 Hanyangdeahak-ro, Sangnok-gu, Ansan, Gyeonggi-do, 15588, Korea+82-31-400-4269 sweetbrain@hanyang.ac.kr
COPYRIGHT © 2021 HANYANG UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.