다층 배선에서 차폐효과 모델 및 스위칭에 미치는 영향

Abstract

New capacitance modeling and transient analysis for multi-layer interconnects with shielding effect are presented. The upper layer capacitances with under-layer shielding lines are represented by introducing a filling factor which can be defined as the ratio of upper-layer line length to the total under-layer line width.