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전도성 캐리어(carrier)를 이용한 TSV(Through-Si-Via) 형성 공정Formation of TSV with conductive carrier
- Alternative Title
- Formation of TSV with conductive carrier
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- 유봉영[유봉영]
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Related Researcher
- Yoo, Bong young
- ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)