코어-쉘 구조의 입자를 이용한 TSV(Through-Si-Via) 형성

좌용호[좌용호]; 유봉영[유봉영]

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코어-쉘 구조의 입자를 이용한 TSV(Through-Si-Via) 형성Formation of TSV with core-shell type particles

Alternative Title: Formation of TSV with core-shell type particles

Authors: 좌용호[좌용호]; 유봉영[유봉영]

URI: https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/34852

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Appears in Collections: COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 4. Patents

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CHOA, YONG HO: ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)

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