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2.5D 칩 환경하에서 Reflection 신호차를 통한 인터컨넥션 폴트의 위치 분석 방법Method of locating interconnection fault by analyzing reflection signal under 2.5D chip environment
- Alternative Title
- Method of locating interconnection fault by analyzing reflection signal under 2.5D chip environment
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- 백상현[백상현]
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Collections - COLLEGE OF ENGINEERING SCIENCES > SCHOOL OF ELECTRICAL ENGINEERING > 4. Patents
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Related Researcher
- Baeg, Sanghyeon
- ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)