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Synthesis of Fe metal precipitated colloidal silica and its application to W chemical mechanical polishing (CMP) slurry

Authors
Kang, Young-JaePrasad, Y. NagendraKim, In-KwonJung, Seok-JoPark, Jin-Goo
Issue Date
Sep-2010
Publisher
Academic Press
Keywords
W CMP; Fe precipitation on colloidal silica; Slurry stability; Removal rate; Selectivity
Citation
Journal of Colloid and Interface Science, v.349, no.1, pp.402 - 407
Indexed
SCIE
SCOPUS
Journal Title
Journal of Colloid and Interface Science
Volume
349
Number
1
Start Page
402
End Page
407
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/39564
DOI
10.1016/j.jcis.2010.04.083
ISSN
0021-9797
Abstract
The objective of this paper is to develop a new method of Fe (metal) precipitation on colloidal silica to overcome the stability problem, which would be responsible in producing defects, with commercially available fumed silica slurry containing Fe ions. The slurry was developed by using sodium silicate (Na2SiO3) as a raw material and the concentration of precipitation of metal was controlled by addition of Fe salt (Fe(NO3)(3)). To compare the concentration of precipitated Fe with directly added Fe ions in slurry solutions, static electrochemical and peroxide decomposition experiments were performed. Although the performance of the Fe precipitation appeared to be lower than Fe ion addition during these experiments, nearly equal removal rate was observed due to the dynamic condition during polishing. The Fe precipitated colloidal silica particles at the concentration of 52 ppm showed the similar W removal rate and selectivity of W to TEOS (tetraethylorthosilicate) to commercially available fumed silica slurry containing externally added Fe ions. The introduction of Fe particle precipitation on colloidal silica particles would result in a longer shelf life time and hence lower defect level in W CMP. (C) 2010 Elsevier Inc. All rights reserved.
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Park, Jin Goo
ERICA 공학대학 (DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING)
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