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Mechanism of Embedded Micro/Nano Channel Formation for a Negative-tone Photoresist by Moving Mask Lithography
- Authors
- Kim, Sang-Kon; Oh, Hye-Keun; Jung, Young-Dae; An, Ilsin
- Issue Date
- Mar-2010
- Publisher
- KOREAN PHYSICAL SOC
- Keywords
- Lithography; Lithography simulation; Negative resist; Chemically amplified resist; Multi-exposures; Inverse lithography; Embedded fluidic channels; MEMS
- Citation
- JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.56, no.3, pp.851 - 855
- Indexed
- SCIE
SCOPUS
KCI
- Journal Title
- JOURNAL OF THE KOREAN PHYSICAL SOCIETY
- Volume
- 56
- Number
- 3
- Start Page
- 851
- End Page
- 855
- ISSN
- 0374-4884
- Abstract
- Photoresist lithography has been applied in MEMS (micro electro mechanical systems). A flexible 3D (three-dimensional) micro/nano fabrication technique and its process simulation tool are required for 3D MEMS. This paper presents an UV (ultraviolet) lithography process simulation for the formation of an embedded micro/nano fluidic channel in a negative-tone photoresist. For this purpose, the moving-mask technology is modeled. The simulation algorithm of the nanolithography is applied for the micro-lithography. The validity of the simulation for the proposed 3D microstructuring is successfully confirmed by a, comparison between the experimental and the simulated results. Hence, modeling and simulation for the formation of various patterns of micro/nano fluidic channels in a negative-tone photoresist can be used to provide the photoresist characteristics and to optimize the lithography process conditions.
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Related Researcher
- Jung, Young Dae
- COLLEGE OF SCIENCE AND CONVERGENCE TECHNOLOGY (DEPARTMENT OF APPLIED PHYSICS)