Signal integrity verification of coupled interconnect lines using efficient eye-diagram determination
- Authors
- Kim, Dongchul; Kim, Hyewon; Eo, Yungseon
- Issue Date
- Jun-2010
- Publisher
- IEEE
- Keywords
- Finite size; Interconnect lines; Worst case; Eigen modes; Computer simulation; Electric lines; Bit patterns; Eye-diagram; Fundamental modes; Signal Integrity; Crosstalk effect; Model-based simulations; SPICE simulations; Coupled lines; Verification method
- Citation
- ISCAS 2010 - 2010 IEEE International Symposium on Circuits and Systems: Nano-Bio Circuit Fabrics and Systems, pp.3669 - 3672
- Indexed
- OTHER
- Journal Title
- ISCAS 2010 - 2010 IEEE International Symposium on Circuits and Systems: Nano-Bio Circuit Fabrics and Systems
- Start Page
- 3669
- End Page
- 3672
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/40460
- DOI
- 10.1109/ISCAS.2010.5537774
- ISSN
- 0271-4302
- Abstract
- An efficient signal integrity verification method of coupled interconnect lines is presented. Two coupled lines are decoupled into isolated eigen modes. Then, bit blocks for coupled lines which are composed of the finite size of bits are represented with the fundamental modes. In addition, the crosstalk effects within the bit block are taken into account. Thereby, the crucial input bit patterns for the worst case eye-diagram determination are mathematically modeled, followed by analytical eye-diagram determination. It is shown that not only the proposed technique has excellent agreement with SPICE W-model-based simulation but also is it very computation-time-efficient, compared with SPICE simulation. ©2010 IEEE.
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