Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Signal integrity verification of coplanar structures for shielded on-chip interconnect lines

Authors
Khan, ZafarKim, HyewonEo, Yungseon
Issue Date
Nov-2009
Publisher
IEEE
Keywords
On chip interconnect; Bit rates; Interconnect lines; Area savings; Electric lines; Signal Integrity; Programmable logic controllers; Ground signal grounds; On chips; Quality assurance; Transmission line; Ground structure; Coplanar structure; Coplanar wave
Citation
2009 International SoC Design Conference
Indexed
OTHER
Journal Title
2009 International SoC Design Conference
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/40694
DOI
10.1109/SOCDC.2009.5423861
Abstract
This paper analyses and compares two Coplanar Structures to be employed as shielded structures for on-chip critical interconnect lines such as clock. It is believed that at lower bit rates, on-chip area overhead caused by the Ground-Signal-Ground structure can be mitigated by a coplanar Power-Signal-Ground structure, if the performance of the two is not much different. However at higher bit rates, in addition to area saving, the later structure is shown to be better performance wise. ©2009 IEEE.
Files in This Item
Go to Link
Appears in
Collections
COLLEGE OF ENGINEERING SCIENCES > SCHOOL OF ELECTRICAL ENGINEERING > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Related Researcher

Researcher EO, YUNG SEON photo

EO, YUNG SEON
ERICA 공학대학 (SCHOOL OF ELECTRICAL ENGINEERING)
Read more

Altmetrics

Total Views & Downloads

BROWSE