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Stackable All-Oxide-Based Nonvolatile Memory With Al2O3 Antifuse and p-CuOx/n-InZnOx Diode

Authors
Ahn, Seung-EonKang, Bo SooKim, Ki HwanLee, Myoung-JaeLee, Chang BumStefanovich, GenrikhKim, Chang JungPark, Youngsoo
Issue Date
May-2009
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Antifuse; one-time field-programmable (OTP) memory; oxide diode
Citation
IEEE ELECTRON DEVICE LETTERS, v.30, no.5, pp.550 - 552
Indexed
SCIE
SCOPUS
Journal Title
IEEE ELECTRON DEVICE LETTERS
Volume
30
Number
5
Start Page
550
End Page
552
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/41274
DOI
10.1109/LED.2009.2016582
ISSN
0741-3106
Abstract
We developed all-oxide-based nonvolatile memory for low-cost, high-density, and high-performance one-time field-programmable (OTP) memories compared with Si-based antifuse memory using antifuse technologies over a glass substrate. The oxide OTP memory employed the p-n CuO/InZnOx diode as the switching element of the memory cell and Al2O3 for the antifuse as the storage node of the memory cell. The memory cell is programmed from the breakdown of Al2O3 by applying a program voltage bias that is about 4.5 V. The OTP memory cells show large on/off ratio of about 10(6) and small current distributions at programmed and unprogrammed states resulting from the perfect uniformity of Al2O3 thin film before and after breakdown. It also showed a fast programming speed of about 20 ns.
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