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Fabrication of stainless steel mold using electrochemical fabrication method for microfluidic biochip

Authors
Cho, Min-SooLim, Hyun-WooLee, Caroline SunyongCho, Byung-KiPark, Jin-Goo
Issue Date
Jun-2008
Publisher
IOP Publishing Ltd
Keywords
SUS mold; ECF method; injection molding
Citation
Japanese Journal of Applied Physics, v.47, no.6, pp 5217 - 5220
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
Japanese Journal of Applied Physics
Volume
47
Number
6
Start Page
5217
End Page
5220
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/42438
DOI
10.1143/JJAP.47.5217
ISSN
0021-4922
1347-4065
Abstract
Imprinting method mechanically transfers patterns from a stamp onto a substrate. In imprinting process, the mold is one of the most important factors. A new micro fabrication method termed electrochemical fabrication (ECF) is introduced to overcome conventional problems of electrical discharge machining (EDM), FeCl3 Wet etching, laser method, electro plating, such as low reliability and reproducibility, high cost. This ECF method defines micro patterns using a conventional photolithography, allowing it to produce micro-scale patterns with an excellent surface roughness and of excellent quality. In this paper, a 150 mm stainless steel (SUS 304, 5 turn in thickness) mold was fabricated using both ECF method and FeCl3-etchant method, respectively. As a result, the ECF mold resulted 10 times better surface roughness values than that of mold using FeCl3 etchant. Also, metal surface of the ECF-SUS mold was cleaner and smoother than that the FeCl3 etched SUS mold. Therefore, SUS mold was successfully fabricated for the first time in micro-scale and multi-step patterns. Plastic replica was fabricated successfully using the ECF-SUS mold.
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Lee, Sunyong Caroline
ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)
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