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Acoustic field analysis of a T type waveguide in single wafer megasonic cleaning and its effect on particle removal
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Yang Lae | - |
| dc.contributor.author | Lim, Eui Su | - |
| dc.contributor.author | Kang, Kook Jin | - |
| dc.contributor.author | Kim, Hyun Se | - |
| dc.contributor.author | Kim, Tae Gon | - |
| dc.contributor.author | Lee, Sang Ho | - |
| dc.contributor.author | Park, Jin-Goo | - |
| dc.date.accessioned | 2021-06-23T18:40:34Z | - |
| dc.date.available | 2021-06-23T18:40:34Z | - |
| dc.date.issued | 2008-00 | - |
| dc.identifier.issn | 1012-0394 | - |
| dc.identifier.issn | 1662-9779 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/43063 | - |
| dc.description.abstract | T type megasonic waveguide was analyzed by finite element method (FEM), acoustic pressure measurements and particle removal efficiency for the single wafer cleaning application. Compared to conventional longitudinal waves, a transverse waves were generated in a T type waveguide. Not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency. © (2008) Trans Tech Publications, Switzerland. | - |
| dc.format.extent | 4 | - |
| dc.language | 영어 | - |
| dc.language.iso | ENG | - |
| dc.publisher | Scitec Publications Ltd. | - |
| dc.title | Acoustic field analysis of a T type waveguide in single wafer megasonic cleaning and its effect on particle removal | - |
| dc.type | Article | - |
| dc.publisher.location | 스위스 | - |
| dc.identifier.doi | 10.4028/www.scientific.net/SSP.134.229 | - |
| dc.identifier.scopusid | 2-s2.0-38549112449 | - |
| dc.identifier.wosid | 000253389300053 | - |
| dc.identifier.bibliographicCitation | Solid State Phenomena, v.134, pp 229 - 232 | - |
| dc.citation.title | Solid State Phenomena | - |
| dc.citation.volume | 134 | - |
| dc.citation.startPage | 229 | - |
| dc.citation.endPage | 232 | - |
| dc.type.docType | Conference Paper | - |
| dc.description.isOpenAccess | N | - |
| dc.description.journalRegisteredClass | scie | - |
| dc.description.journalRegisteredClass | scopus | - |
| dc.relation.journalResearchArea | Engineering | - |
| dc.relation.journalResearchArea | Materials Science | - |
| dc.relation.journalResearchArea | Physics | - |
| dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
| dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
| dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
| dc.subject.keywordPlus | Acoustic fields | - |
| dc.subject.keywordPlus | Efficiency | - |
| dc.subject.keywordPlus | Shear waves | - |
| dc.subject.keywordPlus | Silicon wafers | - |
| dc.subject.keywordPlus | Waveguides | - |
| dc.subject.keywordPlus | Acoustic field analysis | - |
| dc.subject.keywordPlus | Acoustic pressure measurements | - |
| dc.subject.keywordPlus | Cleaning efficiency | - |
| dc.subject.keywordPlus | Megasonics | - |
| dc.subject.keywordPlus | Particle removal | - |
| dc.subject.keywordPlus | Particle removal efficiency | - |
| dc.subject.keywordPlus | Single-wafer cleaning | - |
| dc.subject.keywordPlus | Sonic waves | - |
| dc.subject.keywordPlus | Cleaning | - |
| dc.subject.keywordAuthor | Megasonic | - |
| dc.subject.keywordAuthor | Particle removal | - |
| dc.subject.keywordAuthor | Single wafer cleaning | - |
| dc.subject.keywordAuthor | Transverse sonic wave | - |
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)