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Acoustic field analysis of a T type waveguide in single wafer megasonic cleaning and its effect on particle removal
- Authors
- Lee, Yang Lae; Lim, Eui Su; Kang, Kook Jin; Kim, Hyun Se; Kim, Tae Gon; Lee, Sang Ho; Park, Jin-Goo
- Issue Date
- Dec-2007
- Publisher
- Scitec Publications Ltd.
- Keywords
- Megasonic; Particle removal; Single wafer cleaning; Transverse sonic wave
- Citation
- Solid State Phenomena, v.134, pp 229 - 232
- Pages
- 4
- Indexed
- SCIE
SCOPUS
- Journal Title
- Solid State Phenomena
- Volume
- 134
- Start Page
- 229
- End Page
- 232
- ISSN
- 1012-0394
1662-9779
- Abstract
- T type megasonic waveguide was analyzed by finite element method (FEM), acoustic pressure measurements and particle removal efficiency for the single wafer cleaning application. Compared to conventional longitudinal waves, a transverse waves were generated in a T type waveguide. Not like longitudinal waves, transverse waves showed changes of direction and phase which increased the cleaning efficiency. © (2008) Trans Tech Publications, Switzerland.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)