새로운 공정을 이용한 AlN 체적 탄성파 소자의 제작 및 다양한 금속 전극막에 따른 주파수 응답 특성 분석Fabrication of AlN-based FBAR Devices by Using a Novel Process and Characterization of Their Frequency Response Characteristics in terms of Various Electrode Metals
- Other Titles
- Fabrication of AlN-based FBAR Devices by Using a Novel Process and Characterization of Their Frequency Response Characteristics in terms of Various Electrode Metals
- Authors
- 김보현; 박창균; 박진석
- Issue Date
- May-2007
- Publisher
- 대한전기학회
- Keywords
- Aluminum nitride (AlN); Film bulk acoustic resonator (FBAR); Membrane-structure; Metal electrode; Mass-loading effect; Frequency response.1. 서 론*學生會員 : 漢陽大學 電子電氣制御計測工學科 工學碩士; Aluminum nitride (AlN); Film bulk acoustic resonator (FBAR); Membrane-structure; Metal electrode; Mass-loading effect; Frequency response.1. 서 론*學生會員 : 漢陽大學 電子電氣制御計測工學科 工學碩士
- Citation
- 전기학회논문지ABCD, v.56, no.5, pp 915 - 920
- Pages
- 6
- Indexed
- SCOPUS
KCI
- Journal Title
- 전기학회논문지ABCD
- Volume
- 56
- Number
- 5
- Start Page
- 915
- End Page
- 920
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44121
- ISSN
- 1229-2443
- Abstract
- - AlN-based film bulk acoustic resonator (FBAR) devices which adopt a membrane-type configuration such as Mo/AlN/bottom-metal/Si are fabricated by employing a novel process. The proposed resonator structure does not require any supporting layer above the substrate, which leads to the reduction in energy loss of the resonators. For all the FBAR devices, the frequency response characteristics are measured and the device parameters, such as return loss and input impedance, are extracted from the frequency responses, and analyzed in terms of the various metals such as Al, Cu, Mo, W used in the bottom-electrode. The mass-loading effect caused by the used bottom-electrode metals is found to be the main reason for the difference revealed in the measured characteristics of the fabricated FBAR devices. The results obtained in this study also show that the degree of match in lattice constant and thermal expansion coefficient between piezoelectric layers and electrode metals is crucial to determine the device performance of FBAR.
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