Effect of diamonds on pad recovery in oxide and metal pad conditioning process
- Authors
- Kang, Bong kyun; Kang, Young jae; Kim, Kyu chae; Park, Jin-Goo; Lee, Joo hwan; Ahn, Jung su
- Issue Date
- 2007
- Publisher
- VDE Verlag GmbH
- Keywords
- Chemical Mechanical Polishing; Diamond conditioner disk; Diamond density; Diamond size; Pad conditioning; Pad recovery
- Citation
- ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings, pp.455 - 460
- Indexed
- SCOPUS
- Journal Title
- ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
- Start Page
- 455
- End Page
- 460
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44231
- Abstract
- The asperity and roughness of a pad surface have an effect on removal rate and uniformity of wafer surfaces during CMP process. The regeneration or conditioning of pad surfaces during and after CMP is required to maintain the removal rate and uniformity constant. In conditioning process, the rate of pad recovery can be determined by characteristics of diamond on metal disk such as the size, shape, density and arrangement of diamonds. However, root causes affecting pad recovery in oxide and metal conditioning have not yet reported due to its proprietary nature. In this study, the efficiency of pad recovery was evaluated at different size, density, shape and arrangement of diamonds on conditioner disk in metal and oxide pad conditioning process. In oxide conditioning, the larger size and higher density of diamonds on conditioner, the higher pad recovery rate was measured. In metal conditioning, the smaller diamond size, and lower density, the higher recovery rates. © ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings. All rights reserved.
- Files in This Item
-
Go to Link
- Appears in
Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44231)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.