Post-CMP Cleaning
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, Jin-Goo | - |
dc.contributor.author | Busnaina, Ahmed A. | - |
dc.contributor.author | Hong, Yi-Koan | - |
dc.date.accessioned | 2021-06-23T20:40:40Z | - |
dc.date.available | 2021-06-23T20:40:40Z | - |
dc.date.created | 2021-02-01 | - |
dc.date.issued | 2007-03 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/44242 | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | John Wiley & Sons, Inc. | - |
dc.title | Post-CMP Cleaning | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Park, Jin-Goo | - |
dc.identifier.doi | 10.1002/9780470180907.ch16 | - |
dc.identifier.scopusid | 2-s2.0-84889807893 | - |
dc.identifier.bibliographicCitation | Microelectronic Applications of Chemical Mechanical Planarization, pp.467 - 509 | - |
dc.relation.isPartOf | Microelectronic Applications of Chemical Mechanical Planarization | - |
dc.citation.title | Microelectronic Applications of Chemical Mechanical Planarization | - |
dc.citation.startPage | 467 | - |
dc.citation.endPage | 509 | - |
dc.type.rims | ART | - |
dc.type.docType | Book Chapter | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | Double-sided scrubber and spin-rinse dryer | - |
dc.subject.keywordAuthor | Hydrodynamic boundary layer | - |
dc.subject.keywordAuthor | Single-wafer megasonic cleaner | - |
dc.identifier.url | https://onlinelibrary.wiley.com/doi/10.1002/9780470180907.ch16 | - |
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