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Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작
- Other Titles
- 핫 엠보싱 공정을 이용한 플라스틱 CE(capillary electrophoresis) 마이크로 칩의 제작
- Issue Date
- Jun-2005
- Publisher
- 한국정밀공학회
- Keywords
- Nanoimprint(나노임프린트); Hot Embossing(핫 엠보싱); Capillary Electrophoresis(모세관 전기영동); Plastic Chip(플라스틱 칩)
- Citation
- 한국정밀공학회 2005년도 춘계학술대회 논문집, pp 1140 - 1144
- Pages
- 5
- Indexed
- OTHER
- Journal Title
- 한국정밀공학회 2005년도 춘계학술대회 논문집
- Start Page
- 1140
- End Page
- 1144
- ISSN
- 20058446
- Abstract
- A plastic-based CE (capillary electrophoresis) microchip was fabricated by hot embossing process. A Si mold was made by wet etching process and a PMMA wafer was cut off from 1mm thick PMMA sheet. A micro-channel structure on PMMA substrate was produced by hot embossing process using the Si mold and the PMMA wafer. A vacuum assisted thermal bonding procedure was employed to seal an imprinted PMMA wafer and a blank PMMA wafer. The results of microscopic cross sectional images showed dimensions of channels were well preserved during thermal bonding process. In our procedure, the deformation amount of bonding process was below 1%. The entire fabrication process may be very useful for plastic based microchip systems.
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Related Researcher
- Park, Jin Goo
- ERICA 첨단융합대학 (ERICA 신소재·반도체공학전공)