Fabrication of metal line on plastic substrate by hot embossing and CMP process
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 차남구 | - |
dc.contributor.author | 강영재 | - |
dc.contributor.author | 박창화 | - |
dc.contributor.author | 임현우 | - |
dc.contributor.author | 박진구 | - |
dc.date.accessioned | 2021-06-23T23:06:55Z | - |
dc.date.available | 2021-06-23T23:06:55Z | - |
dc.date.created | 2021-02-18 | - |
dc.date.issued | 2005-06 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/45889 | - |
dc.description.abstract | In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates. | - |
dc.language | 한국어 | - |
dc.language.iso | ko | - |
dc.publisher | 한국전기전자재료학회 | - |
dc.title | Fabrication of metal line on plastic substrate by hot embossing and CMP process | - |
dc.title.alternative | 핫 엠보싱 공정과 CMP 공정을 이용한 플라스틱 기판에 메탈 라인 형성 | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | 박진구 | - |
dc.identifier.bibliographicCitation | 한국전기전자재료학회 하계학술대회 논문집, pp.655 - 656 | - |
dc.relation.isPartOf | 한국전기전자재료학회 하계학술대회 논문집 | - |
dc.citation.title | 한국전기전자재료학회 하계학술대회 논문집 | - |
dc.citation.startPage | 655 | - |
dc.citation.endPage | 656 | - |
dc.type.rims | ART | - |
dc.description.journalClass | 3 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | other | - |
dc.subject.keywordAuthor | CMP | - |
dc.subject.keywordAuthor | chemical mechanical planarization | - |
dc.subject.keywordAuthor | hot embossing | - |
dc.subject.keywordAuthor | plastic substrate | - |
dc.subject.keywordAuthor | metal line | - |
dc.identifier.url | https://koreascience.kr/article/CFKO200525363153666.page | - |
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