Fabrication of metal line on plastic substrate by hot embossing and CMP process핫 엠보싱 공정과 CMP 공정을 이용한 플라스틱 기판에 메탈 라인 형성
- Other Titles
- 핫 엠보싱 공정과 CMP 공정을 이용한 플라스틱 기판에 메탈 라인 형성
- Authors
- 차남구; 강영재; 박창화; 임현우; 박진구
- Issue Date
- Jun-2005
- Publisher
- 한국전기전자재료학회
- Keywords
- CMP; chemical mechanical planarization; hot embossing; plastic substrate; metal line
- Citation
- 한국전기전자재료학회 하계학술대회 논문집, pp.655 - 656
- Indexed
- OTHER
- Journal Title
- 한국전기전자재료학회 하계학술대회 논문집
- Start Page
- 655
- End Page
- 656
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/45889
- Abstract
- In the future, plastic based system will play a crucial role in modem life, for examples, transparent display or disposable electronics and so on. In this paper, we introduced a new method to fabricate the metal line on the plastic substrate. Metal lines were fabricated by hot embossing and CMP process on PMMA (polymethylmethacrylate) substrates. A Si mold was made by wet etching process and a PMMA wafer was cut off from I mm thick PMMA sheet. A 100 nm thick Al was deposited on PMMA wafers. The Al deposited PMMA wafer and the Si mold carefully sandwiched which was directly imprinted by hot embossing. After imprinting process, a residual Al layer was removed by CMP process. Finally, we found the entire process may be very useful to fabricate the metal line on plastic substrates.
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Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
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