Effect of corrosion inhibitor (BTA) in citric acid based slurry on Cu CMP
- Authors
- Kim, In-Kwon; Kang, Young-Jae; Hong, Yi-Koan; Park, Jin-Goo
- Issue Date
- Nov-2005
- Publisher
- Materials Research Society
- Citation
- Materials Research Society Symposium Proceedings, v.867, pp.3 - 7
- Indexed
- SCOPUS
- Journal Title
- Materials Research Society Symposium Proceedings
- Volume
- 867
- Start Page
- 3
- End Page
- 7
- URI
- https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46444
- DOI
- 10.1557/proc-867-w1.3
- ISSN
- 0272-9172
- Abstract
- In this study, the effect of BTA on polishing behavior was investigated as functions of H2O2, slurry pH and abrasive particles. The addition of BTA effectively prevented Cu from etching by forming the passivation layer of Cu-BTA regardless of pH and H2O2 concentration in slurry. A thinner passivation layer was grown on Cu in BTA added slurry solutions with a higher contact angle of 60°. The dynamic etch rate, the removal rate with abrasive free slurry, also decreased when BTA was added in slurry at pH 2, 4 and 6. The removal rate of Cu was strongly dependent on types of abrasive particles in slurry. The larger hardness of slurry abrasive particles, the higher removal rates of Cu. The reduction of removal rates in BTA added slurry was determined by the © 2005 Materials Research Society competition between chemical dissolution rate and mechanical abrasion rate.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/46444)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.