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Thermal-Aware Design and Management of Embedded Real-Time Systems

Authors
LEE, YOUNG MOON
Issue Date
Feb-2021
Publisher
IEEE
Citation
Design Automation and Test in Europe Conference, pp 1252 - 1255
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
Design Automation and Test in Europe Conference
Start Page
1252
End Page
1255
URI
https://scholarworks.bwise.kr/erica/handle/2021.sw.erica/701
DOI
10.23919/DATE51398.2021.9474042
Abstract
Modern embedded systems face challenges in managing on-chip temperature as they are increasingly realized in powerful system-on-chips. This paper presents thermal-aware design and management of embedded systems by tightly coupling two mechanisms, thermal-aware utilization bound and real-time dynamic thermal management. The former provides the processor utilization upper-bound to meet the chip temperature constraint that depends not only on the system configurations and workloads but also chip cooling capacity and environment. The latter adaptively optimizes rates of individual task executions subject to the thermal-aware utilization bound. Our experiments on an automotive controller demonstrate the thermal-aware utilization bound and improved system utilization by 18.2 % compared with existing approaches.
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LEE, YOUNG MOON
ERICA 공학대학 (DEPARTMENT OF ROBOT ENGINEERING)
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