Lee, Dongmin; Lee, Ahnwoo; Kim, Minchul; Choe, Wonseok; Lee, Chungsik; Yoon, Kwansun; Jeong, Mingeun; Kim, Junghyun
ArticleIssue Date2023CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.13, no.4, pp.511 - 519PublisherInstitute of Electrical and Electronics Engineers Inc.