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S-parameter-measurement-based high-speed signal transient characterization of VLSI interconnects on SiO2-Si substrate
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Eo, Yungseon
; Eisenstadt, William R.;
Shim, Jongin
Article
Issue Date
2000
Citation
IEEE Transactions on Advanced Packaging, v.23, no.3, pp.470 - 479
Publisher
Institute of Electrical and Electronics Engineers
1
Discover
Author
Eisenstadt, William R.
1
Shim, Jong In
1
Subject
CROSSTALK
1
DELAY
1
DOMAIN
1
INTEGRATED-CIRCUITS
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MICROPROCESSOR
1
PROPAGATION
1
s-parameter
1
signal transient
1
silicon substrate
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SIMULATION
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