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2. Conference Papers(COLLEGE OF ENGINEERING SCIENCES > DEPARTMENT OF MATERIALS SCIENCE AND CHEMICAL ENGINEERING > 2. Conference Papers)3,229

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Collection's Items (Sorted by Issue Date in Descending order): 501 to 520 of 3229

기준 상태, 표준 상태의 올바른 정의 및 활동도 계수의 수식화

박주현

ConferenceIssue Date2022Place제주
페라이트계 내열강의 630 ℃ 피로 특성에 미치는 구리 첨가의 영향

김진경

ConferenceIssue Date2022Place제주국제컨벤션센터
페로실리콘 용탕과 슬래그 반응에서 슬래그 조성 변화에 따른 타이타늄 (Ti) 거동에 관한 열역학적 연구

박주현

ConferenceIssue Date2022Place제주
Manufacturing a high cleanness CoCrFeMnNi high-entropy alloy by slagging through induction melting with ferroalloys feedstock

박주현

ConferenceIssue Date2022Place제주
Fe-3.0Si-(1.5Al) 첨가강의 비금속 개재물 거동에 관한 연구

박주현

ConferenceIssue Date2022Place제주
유도용해로를 이용한 Ti(-Ni) 스크랩 용탕으로부터 Ca(-Ni)을 이용한 산소 정련에 관한 연구

박주현

ConferenceIssue Date2022Place제주
전기로 공정에서 산업폐기물 활용에 의한 전력에너지 저감기술

박주현

ConferenceIssue Date2022Place제주
ESR 공정에 의한 9CrMoCoB 및 10CrMoCoWB 소재용 대형 Ingot 제 조

박주현

ConferenceIssue Date2022Place제주
Ti ion contamination and removal mechanism during the W CMP process

박진구

ConferenceIssue Date2022Place온라인
Characterization of impurities from incoming PVA brush for sub 10 nm post CMP cleaning process

박진구

ConferenceIssue Date2022Place온라인
페로실리콘 용탕과 CaO-SiO2-Al2O3 슬래그 간 타이타늄 분배비에 관한 열역학적 연구

박주현

ConferenceIssue Date2022Place대구
Ti(-Ni) 스크랩 용탕의 Ca 탈산에 의한 산소 정련 효과 및 미세조직에 미치는 영향

김진경

ConferenceIssue Date2022Place대구그랜드호텔
Electrodeposition of Ni-Fe alloy in presence of complexing agent and additive

유봉영

ConferenceIssue Date2022Place미국
High purity Pd Nanofilm Deposition via Cu Incorporation Control in SLRR process

유봉영

ConferenceIssue Date2022Place미국
Gold-Reduced Graphene Oxide Composite Coating on Stainless Steel 316L as Bipolar Plate for Proton Exchange Membrane Fuel Cell

유봉영

ConferenceIssue Date2022Place미국
Low Hysteretic and High Reliable Strain Sensors by Applying Piezoresistive-Multilayered Strutures

이화성

ConferenceIssue Date2022Place대구
The PDMS/Ecoflex sponge-based a stretchable strain and pressure sensor

이화성

ConferenceIssue Date2022Place대구
The hydrogen bonding re-establishment strategy for the preparation of applicable hydrogel inks by screen printing process.

이화성

ConferenceIssue Date2022Place대구
Ti CMP process for better topography control in advanced 3D packaging

박진구

ConferenceIssue Date2022Place온라인
Electrochemical investigations on the corrosion and inhibition during W post-CMP cleaning

박진구

ConferenceIssue Date2022Place온라인
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