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MPCVD를 이용한 다결정 다이아몬드 박막의 증착 및 물성 분석

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권상직
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https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/39627
Conference Name
Summer Annual Conference '98(D)
Place
대한민국
metadata.conference.dc.citation.conferenceName
대한 전기 공학회
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IT융합대학 > 전자공학과 > 2. Conference Papers

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Kwon, Sang Jik
반도체대학 (반도체·전자공학부)
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