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Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo- Sensor Circuits
- Authors
- 최창환
- Issue Date
- 30-Jun-2021
- Publisher
- 대한전자공학회
- Citation
- 대한전자공학회 하계학술대회
- Conference Name
- 대한전자공학회 하계학술대회
- Place
- 롯데호텔 제주 (중문)
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Choi, Chang hwan
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)