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Current status on the n/p type oxide semiconductor materials and the associated devices using atomic layer deposition

Authors
Park, Jin-SeongHong, TaeHyunChoi, WanhoKim, HyemiChoi, Su Hwan
Issue Date
Dec-2021
Publisher
International Display Workshops
Keywords
Atomic Layer Deposition (ALD); N-type; Oxide Semiconductor; P-type; Thin Film Transistor (TFT)
Citation
Proceedings of the International Display Workshops, v.27, pp.137 - 140
Indexed
SCOPUS
Journal Title
Proceedings of the International Display Workshops
Volume
27
Start Page
137
End Page
140
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/138585
ISSN
1883-2490
Abstract
Atomic Layer Deposition (ALD) has been introduced for oxide semiconductor synthesis and the device applications. Interestingly, ALD enable to deposit not only high-performance oxide semiconductor (a-IGZO etc.) but also p-type oxide semiconductors (CuO and SnO) at low deposition temperature. It will have a great potential to solve the current material and device issues. ALD will be the emerging thin film process in the coming display application.
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COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)
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