HF 습식 식각을 이용한 극자외선 노광 기술용 SiNx 펠리클 제작 공정Manufacturing SiNx extreme ultraviolet pellicle with HF wet etching process
- Other Titles
- Manufacturing SiNx extreme ultraviolet pellicle with HF wet etching process
- Authors
- 김지은; 김정환; 홍성철; 조한구; 안진호
- Issue Date
- Sep-2015
- Publisher
- 한국반도체디스플레이기술학회
- Keywords
- EUV lithography; pellicle; wet etching; SiNx membrane
- Citation
- 반도체디스플레이기술학회지, v.14, no.3, pp.7 - 11
- Indexed
- KCI
- Journal Title
- 반도체디스플레이기술학회지
- Volume
- 14
- Number
- 3
- Start Page
- 7
- End Page
- 11
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156405
- ISSN
- 1738-2270
- Abstract
- In order to protect the patterned mask from contamination during lithography process, pellicle has become a critical component for Extreme Ultraviolet (EUV) lithography technology. According to EUV pellicle requirements, the pellicle should have high EUV transmittance and robust mechanical property. In this study, silicon nitride, which is well-known for its remarkable mechanical property, was used as a pellicle membrane material to achieve high EUV transmittance. Since long silicon wet etching process time aggravates notching effect causing stress concentration on the edge or corner of etched structure, the remaining membrane is prone to fracture at the end of etch process. To overcome this notching effect and attain high transmittance, we began preparing a rather thick (200 nm) SiNx membrane which can be stably manufactured and was thinned into 43 nm thickness with HF wet etching process. The measured EUV transmittance shows similar values to the simulated result. Therefore, the result shows possibilities of HF thinning processes for SiNx EUV pellicle fabrication.
- Files in This Item
-
Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.