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Improvement in Device Performance of a-InGaZnO Transistors by Introduction of Ca-Doped Cu Source/Drain Electrode

Authors
Lee, Sang HoOh, Dong JuHwang, Ah YoungHan, Dong SukKim, ShinJeong, Jae KyeongPark, Jong Wan
Issue Date
Aug-2015
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Ca-doped Cu; low resistivity; a-IGZO; diffusion barrier; high performance; thin-film transistors
Citation
IEEE ELECTRON DEVICE LETTERS, v.36, no.8, pp.802 - 804
Indexed
SCIE
SCOPUS
Journal Title
IEEE ELECTRON DEVICE LETTERS
Volume
36
Number
8
Start Page
802
End Page
804
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/156654
DOI
10.1109/LED.2015.2445348
ISSN
0741-3106
Abstract
This letter reports the effects of Ca doping into Cu films, which was used as a source/drain (S/D) electrode for high performance amorphous In-Ga-Zn-O (IGZO) thinfilm transistors (TFTs) with a low resistive-capacitive delay time. The IGZO TFTs with Ca-doped Cu S/D exhibited three times higher saturation mobility (16 cm(2)/Vs) and substantially lower subthreshold gate swing of 0.39 V/decade than the control devices with pure Cu S/D. The SIMS profile and cross-sectional transmission electron microscopy showed that Ca effectively prevented the Cu atoms from diffusing into channel IGZO region presumably as a result of Ca-O bond formation, which is responsible for their superior device performances.
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Jeong, Jae Kyeong
COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)
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