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Analysis of trap distribution in polysilicon channel transistors using the variable amplitude charge pumping method

Authors
Nguyen, Manh-CuongJeon, Yoon-SeokTong, Duc-TaiYou, Seung-WonJeong, Jae KyeongKim, BioAhn, Jae-YoungHwang, KihyunChoi, Rino
Issue Date
Dec-2014
Publisher
PERGAMON-ELSEVIER SCIENCE LTD
Keywords
Channel trap density; Charge pumping; Grain size effect; Hot carrier injection; Polysilicon; Trap distribution
Citation
SOLID-STATE ELECTRONICS, v.104, pp.86 - 89
Indexed
SCIE
SCOPUS
Journal Title
SOLID-STATE ELECTRONICS
Volume
104
Start Page
86
End Page
89
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/158330
DOI
10.1016/j.sse.2014.11.015
ISSN
0038-1101
Abstract
The trap distribution of a polysilicon (poly-Si) channel in a metal-oxide-semiconductor field effect transistor (MOSFET) was extracted successfully using a variable amplitude charge pumping method (VACP) and an energy band bending model. Compared to single crystal Si channels, the poly-Si channels exhibited a high density of bulk channel traps due to the presence of grain boundaries. The densities of the trap states existing in the poly-silicon channel with various grain sizes and channel thicknesses were extracted and compared. The grain size of poly-Si was found to have a stronger impact on the trap distribution than the channel thickness. After hot carrier stress, the trap density in the poly-silicon channel increases and the generated traps are located both at mid gap energy level and near the conduction band energy level.
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Jeong, Jae Kyeong
COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)
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