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Real time thickness measurement based on terahertz time-domain spectroscopy for chip-top epoxy molding compound in semiconductor package
- Issue Date
- Oct-2018
- Publisher
- IEEE Computer Society
- Citation
- 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), v.2018, no.September
- Indexed
- SCOPUS
- Journal Title
- 2018 43rd International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)
- Volume
- 2018
- Number
- September
- Abstract
- The refractive index and thickness of EMC were measured non-destructively using the terahertz time-domain spectroscopy (THz-TDS) system. A theoretical model was developed using an analysis of time response on transmission and reflection THz signals. Using this developed theoretical model, the refractive index of EMC was measured within 1% of the error range. Simultaneously, the thickness of EMC was calculated through the measured refractive index and induced time delay. As a result, the refractive index and thickness of EMC was measured within the error range of 0.9% and 3.0%, respectively.
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)