High polishing selectivity ceria slurry for formation of top electrode in spin-transfer torque magnetic random access memory
- Authors
- Cui, Hao; Lim, Jae-Hyung; Park, Jin-Hyung; Park, Jea-Gun
- Issue Date
- Nov-2012
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- Spin-transfer torque magnetic random access memory; Chemical mechanical polishing; Ruthenium; Tantalum; Poly(acrylamide); Ceria; Zeta potential
- Citation
- THIN SOLID FILMS, v.522, pp.212 - 216
- Indexed
- SCIE
SCOPUS
- Journal Title
- THIN SOLID FILMS
- Volume
- 522
- Start Page
- 212
- End Page
- 216
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/164315
- DOI
- 10.1016/j.tsf.2012.09.044
- ISSN
- 0040-6090
- Abstract
- During the formation of the top electrode (T. E.) in spin-transfer torque magnetic random access memory, a slurry with a high polishing rate of SiO2 and a low polishing rate of metal (T. E. material) is required in the chemical mechanical planarization application area. We used a ceria-based slurry with a polymeric additive to maintain the high polishing rate of SiO2 while it suppresses the polishing rate of the T. E. material, tantalum and ruthenium. We found ruthenium showed a significantly higher selectivity than tantalum in the ceria-based slurry. X-ray photoelectron spectroscopy was used to investigate the adsorption characteristics of the polymeric additive on the T. E. material. Except for the adsorbed polymeric additive, we found that zeta potential of the T. E. material played a critical role in determining the polishing selectivity of SiO2-to-T.E. material.
- Files in This Item
-
Go to Link
- Appears in
Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
![qrcode](https://api.qrserver.com/v1/create-qr-code/?size=55x55&data=https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/164315)
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.