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Life-Prediction of SAC305/Bi-based Hybrid Solder Joint Considering Bi-Diffused Layers with Gradual Bi Concentrations
- Issue Date
- May-2023
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- bismuth diffusion; hybrid solder joint; life-prediction; solder reliability; thermal shock test
- Citation
- Proceedings - Electronic Components and Technology Conference, v.2023-May, pp.2001 - 2006
- Indexed
- SCOPUS
- Volume
- 2023-May
- Start Page
- 2001
- End Page
- 2006
- ISSN
- 0569-5503
- Abstract
- Reliability of SAC-LTS hybrid joints is assessed. Two tasks are conducted to achieve the goal. The first task involves determination of the Bi concentration dependent constitutive properties. A simple solder assembly is fabricated to examine the distribution of Bi concentration within a hybrid solder joint. Based on the distribution results, specimens with known Bi concentrations are fabricated and tested at various temperatures to obtain the constants of the Anand model as a function of Bi concentration. In the second task, an FEM model is developed to simulate various layers with different Bi concentrations in the hybrid joint. The well-known energy-based fatigue model is implemented to predict the cycles to failure. The prediction is compared with actual thermal shock testing data, and the results are discussed.
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)