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Improved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al₂O₃ composition in atomic layer deposited HfAlOx gate dielectricsImproved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al2O3 composition in atomic layer deposited HfAlOx gate dielectrics

Other Titles
Improved performance of gate-last FDSOI tunnel field-effect-transistors (TFETs) with modulating Al2O3 composition in atomic layer deposited HfAlOx gate dielectrics
Authors
Lim, DonghwanLee, Jae HoChoi, Changhwan
Issue Date
Jun-2017
Publisher
ELSEVIER
Keywords
TFET; Subthreshold swing; Hafnium aluminum oxide; Atomic layer deposition
Citation
MICROELECTRONIC ENGINEERING, v.178, pp.266 - 270
Indexed
SCIE
SCOPUS
Journal Title
MICROELECTRONIC ENGINEERING
Volume
178
Start Page
266
End Page
270
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/19688
DOI
10.1016/j.mee.2017.05.039
ISSN
0167-9317
Abstract
We have studied the electrical characteristics of both n-type and p-type fully depleted silicon on insulator (FDSOI) tunnel field-effect transistors (TFETs) by modulating Al₂O₃ fraction (25%, 50%) within atomic layer deposited HfAlOx gate dielectric. Compared to HfO₂ alone, lower subthreshold swing (S.S), higher I-on,/I-off, and stronger threshold voltage (V-th) immunity against electrical stress are obtained for both n-type and p-type TFETs by adopting nano-laminated atomic layer deposited HfAlOx, attributed to the increased band gap and interfacial layer scavenging effect.
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