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전기도금 전류밀도에 따른 Cu grain 크기 및 wet etch rate에 관한 연구
- Authors
- 김학성
- Issue Date
- 3-Apr-2024
- Conference Name
- 2024년 (사)한국마이크로전자 및 패키징학회(KMEPS) 정기학술대회
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)