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Stabilization of Morphotropic Phase Boundary in Hafnia via Microwave Low-Temperature Crystallization Process for Next-Generation Dynamic Random Access Memory Technology

Authors
Shin, HunbeomKim, GiukLee, SujeongChoi, HyojunLee, SanghoLee, SangmokNam, YunseokKang, GeonhyeongKim, HyungjunAhn, JinhoJeon, Sanghun
Issue Date
Sep-2024
Publisher
Wiley - VCH Verlag GmbH & CO. KGaA
Keywords
DRAM technology; HfO2; low equivalent oxide thickness; low leakage current; morphotropic phase boundary
Citation
physica status solidi (RRL) - Rapid Research Letters, v.18, no.9, pp 1 - 7
Pages
7
Indexed
SCIE
SCOPUS
Journal Title
physica status solidi (RRL) - Rapid Research Letters
Volume
18
Number
9
Start Page
1
End Page
7
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/207907
DOI
10.1002/pssr.202400108
ISSN
1862-6254
1862-6270
Abstract
The morphotropic phase boundary (MPB), which arises from the combination of antiferroelectric and ferroelectric phases, demonstrates the highest dielectric constant (κ) compared to other phases. This emphasizes its potential as a leading contender for dielectric films in future dynamic random access memory (DRAM) capacitors. MPB-based high-κ materials using hafnia have shown a trade-off between equivalent oxide thickness (EOT) and leakage current density (Jleak) when the crystallization temperature increases with scaling the thickness. Herein, a microwave annealing (MWA) method that can achieve low-temperature crystallization below 350 °C is employed. The purpose of this method is to mitigate the trade-off relationships and achieve the strict criteria of current DRAM capacitors. These criteria include low EOT (less than 4 Å) and Jleak (less than 10−7 A cm−2 at 0.8 V) characteristics. The MWA is capable of relatively low-temperature annealing by supplying energy to the films through both thermal energy and dipole vibration energy. As a result, a record-low EOT of 3.76 Å and a low leakage current characteristic of 4.2 × 10−8 A cm−2 at 0.8 V are achieved concurrently. It is confident that the research can be important in addressing the challenges associated with reducing the size of next-generation DRAM capacitors.
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