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Suppression of Gate-Induced-Drain-Leakage Utilizing Local Polarization in Ferroelectric-Gate Field-Effect Transistors for DRAM Applications

Authors
Kwak, BeenLee, KitaeKim, SihyunKwon, Daewoong
Issue Date
May-2024
Publisher
Institute of Electrical and Electronics Engineers
Keywords
dynamic random access memory; FeFET; gate-induced drain leakage; Leakage currents; local polarization; Logic gates; Random access memory; recessed channel; Stress; Subthreshold current; Thermal stability; Transistors
Citation
IEEE Electron Device Letters, v.45, no.5, pp 813 - 816
Pages
4
Indexed
SCIE
SCOPUS
Journal Title
IEEE Electron Device Letters
Volume
45
Number
5
Start Page
813
End Page
816
URI
https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/211150
DOI
10.1109/LED.2024.3370592
ISSN
0741-3106
1558-0563
Abstract
This study proposed a novel approach to enhance the retention characteristics in dynamic random access memory (DRAM) by employing a unique local polarization method, attempting to increase the threshold voltage (<italic>V</italic>th) to reduce subthreshold leakage current while alleviating gate-induced drain leakage (GIDL) current in a ferroelectric gate-field effect transistor with a recessed circular channel. Through the optimization of the position-dependent polarization control along the channel, it is revealed that the polarizations on the source/drain sides can be independently adjusted without interference, resulting in an impressive 80% reduction in GIDL current accompanied by an increase in <italic>V</italic>th by localized polarizations. Moreover, robustness measurements against temperature variations and read stress confirmed the stable maintenance of locally polarized states, underscoring an effective approach to addressing the performance and reliability limitations of DRAM cell transistors.
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