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Prediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation
- Authors
- 김학성
- Issue Date
- 7-Nov-2025
- Place
- 바르미 호텔 인터불고, 대구
- Conference Name
- The 23rd International Symposium on Microelectronics and Packaging
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)