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Rheology behavior and flash light sintering characteristics of Cu/Ag hybrid-ink for multi-layered flexible printed circuit board (FPCB) application in printed electronics
- Authors
- 김학성
- Issue Date
- 4-Dec-2018
- Place
- 미국 하와이
- Conference Name
- PacSurf 2018
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)