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2. Conference Papers(서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers)4,848

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Collection's Items (Sorted by Submit Date in Descending order): 2581 to 2600 of 4848

Nano-size patterning with Nanoimprint Lithography Using PVA transfer layer

안진호

ConferenceIssue Date2010PlaceJapan
The Characterization of N-channel Metal-Oxide-Semiconductor Field-Effect-Transistor (nMOSFET) with Sputtered SrTiO3-Doped HfO2 Gate Dielectrics

최창환

ConferenceIssue Date2010Place무주리조트
MoSi2 코팅된 Alloy617의 고온 내산화특성 평가

김영도

ConferenceIssue Date2010Place무주리조트
W-Ni-Fe 중합금의 기계적 특성에 미치는 미세조직의 영향

김영도

ConferenceIssue Date2010Place무주리조트
Polyol process를 이용한 백금 나노 입자의 합성

김영도

ConferenceIssue Date2010Place무주리조트
Fabrication of Y2O3:Eu3+ gel 2D PC assisted thin-film phosphors using direct nano-imprinting with various working pressure

안진호

ConferenceIssue Date2010PlaceJapan
Magnetic anisotropy of Fe-Pt intermetallic phase on the Pt(100) surface: an ab initio study

정용재

ConferenceIssue Date2010PlaceAtlanta, USA
Talyoring Magnetic Anisotropy of Fe on BaTiO3 and SrTiO3 Surface with Electric Field

정용재

ConferenceIssue Date2010PlaceAtlanta, USA
급속열처리에 의한 폴리이미드 필름 내에 구리 나노입자 형성 관찰

김영호

ConferenceIssue Date2010Citation2010년도 추계 학술대회Publisher한국마이크로전자 및 패키징학회Place연세대학교
Sn-3.0Ag-0.5Cu 솔더와 Ni 또는 Ni-Zn 사이의 계면 반응 연구

김영호

ConferenceIssue Date2010Citation2010년도 추계 학술대회Publisher한국마이크로전자 및 패키징학회Place연세대학교
ACA와 절연된 범프를 이용한 COG본딩

김영호

ConferenceIssue Date2010Citation2010년도 추계 학술대회Publisher한국마이크로전자 및 패키징학회Place연세대학교
비정질 합금의 나노압입 크립에 미치는 압입자 형상의 영향 분석

장재일

ConferenceIssue Date2010Place두산중공업, 창원
Analysis of imaging performance on EUV mask using EUV CSM/ICS

안진호

ConferenceIssue Date2010PlaceKorea
Anode supported Solid Oxide Fuel Cells with electrolyte thin film fabricated by using Electrostatic Slurry Spray Deposition

신동욱

ConferenceIssue Date2010PlaceRamada Plaza Jeju Hotel, Jeju Island, Korea
Film growlh characterization of Fe and Cu on Cu(111) surface in the early stage of the deposition process: a molecular dynamics simulation

정용재

ConferenceIssue Date2010PlaceJeju
Development of ultra fine pitch Chip-on-Glass (COG) bonding with metal bumps having insulating layer in the side wall using Anisotropic conductive Adhesives (ACAs)

김영호

ConferenceIssue Date2010CitationENGE2010, international conference on Electronic Materials and Nanotechnology for Green EnvironmentPublisherThe Korean Institute of Metals and MaterialsPlaceJeju island, Korea
Interfacial Reaction of Sn-3.0Ag-0.5Cu solder with sputtered Ni-Zn under bump metallurgy during soldering and aging

김영호

ConferenceIssue Date2010CitationENGE2010, international conference on Electronic Materials and Nanotechnology for Green EnvironmentPublisherThe Korean Institute of Metals and MaterialsPlaceJeju island, Korea
Study of optical and structural changes in silica photomask glass by laser irradiation

신동욱

ConferenceIssue Date2010PlaceRamada Plaza Jeju Hotel, Jeju Island, Korea
The electronic structure and band gap of Eu doped b-SiAlON with a semilocal exchange correlation potential

정용재

ConferenceIssue Date2010PlaceJeju
Interface analysis of embedded chip resistor device package and its effect on drop shock reliability

김영호

ConferenceIssue Date2010CitationENGE2010, international conference on Electronic Materials and Nanotechnology for Green EnvironmentPublisherThe korean Institute of matals and materialsPlaceJeju island, Korea
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