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테라헤르츠파 비파괴검사법을 이용한 반도체 패키징 내부 공동 검출에 관한 연구The detection of the voids in semiconductor packages using non-destructive evaluation of THz-TDS
- Other Titles
- The detection of the voids in semiconductor packages using non-destructive evaluation of THz-TDS
- Issue Date
- Apr-2015
- Publisher
- 대한기계학회
- Citation
- 대한기계학회 2015년도 재료 및 파괴부문 춘계학술대회 논문집, pp.265 - 266
- Indexed
- OTHER
- Journal Title
- 대한기계학회 2015년도 재료 및 파괴부문 춘계학술대회 논문집
- Start Page
- 265
- End Page
- 266
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Collections - 서울 공과대학 > 서울 기계공학부 > 1. Journal Articles
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Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)