구리 나노입자의 광소결에 의한 기판의 휨 현상 저감 연구

Abstract

A study to reduce the substrate warpage on flash light sintering for copper nanoparticles was investigated. In order to minimize the substrate warpage, two-step flash light sintering method was performed. The flash light sintering process was divided into a preheating step and a main sintering step. To find the optimum sintering conditions of copper nanoparticles, the flash light conditions (irradiation energy, pulse number, on-time and off-time) was varied. The microstructures and transformation crystal phase of the sintered copper nanofilms were analyzed by scanning electron microscopy. In addition, the sheet resistance was measured using a four-point probe method. Also, the thickness of copper nanofilms was measured by alpha-step. From these results, it is found that the flash light sintered copper nanofilms have a low resistivity without any damage to the thin polyimide substrate.