In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics
- Authors
- Hwang, Hyun-Jun; Chung, Wan-Ho; Kim, Hak-Sung
- Issue Date
- Dec-2012
- Publisher
- IOP PUBLISHING LTD
- Citation
- NANOTECHNOLOGY, v.23, no.48, pp.1 - 9
- Indexed
- SCIE
SCOPUS
- Journal Title
- NANOTECHNOLOGY
- Volume
- 23
- Number
- 48
- Start Page
- 1
- End Page
- 9
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/27427
- DOI
- 10.1088/0957-4484/23/48/485205
- ISSN
- 0957-4484
- Abstract
- In this work, a flash-light sintering process for Cu nanoinks was studied. In order to precisely monitor the milliseconds flash-light sintering process, a real-time Wheatstone bridge electrical circuit and a high-rate data acquisition system were used. The effects of several flash-light irradiation conditions (irradiation energy, pulse number, on-time, and off-time) and the effects of the amount of poly(N-vinylpyrrolidone) in the Cu nanoink on the flash-light sintering process were investigated. The microstructures of the sintered Cu films were analyzed by scanning electron microscopy. To investigate the oxidation or reduction of the oxide-covered copper nanoparticles, a crystal phase analysis using x-ray diffraction was performed. In addition, the sheet resistance of Cu film was measured using a four-point probe method. From this study, it was found that the flash-light sintered Cu nanoink films have a conductivity of 72 Omega m/sq without any damage to the polyimide substrate. Similar nanoinks are expected to be widely used in printed and flexible electronics products in the near future.
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