Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Thermo-Compression Flipchip Interconnection using Plasma Enhanced Copper Organic Solderability Preservative Etched Substrate
- Authors
- 정진욱
- Issue Date
- 18-Nov-2013
- Publisher
- Institute of Korea Surface Engineering
- Citation
- International Conference on Surface Engineering 2013
- Conference Name
- International Conference on Surface Engineering 2013
- Place
- Busan
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 전기공학전공 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Chung, Chin Wook
- COLLEGE OF ENGINEERING (MAJOR IN ELECTRICAL ENGINEERING)