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Showing results 1 to 4 of 4
Effects of Complexing Reagent on Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM
Koo, Ja-Kyung;
Lee, Jae-Ho
Article
Issue Date
2017
Citation
MATERIALS TRANSACTIONS, v.58, no.2, pp.148 - 151
Publisher
JAPAN INST METALS
Effects of Complexing Reagents on Electroless Nicke l-Iron Alloy Plating for Diffusion Barrier of UBM
Koo, Ja-Kyung;
Lee, Jae-Ho
Article
Issue Date
2015
Citation
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC), pp.300 - 303
Publisher
IEEE
Electrochemical Process for 3D TSV without CMP and Lithographic Processes
Koo, Ja-Kyung;
Lee, Jae-Ho
Article
Issue Date
2014
Citation
ELECTRONIC MATERIALS LETTERS, v.10, no.2, pp.485 - 490
Publisher
KOREAN INST METALS MATERIALS
Recovery of Bi and Sb from Copper Spent Electrolytes by Electrowinning Method
Koo, Ja-Kyung; Hong, Heung-Ki;
Lee, Jae-Ho
Article
Issue Date
2015
Citation
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.15, no.11, pp.8943 - 8946
Publisher
AMER SCIENTIFIC PUBLISHERS
1
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